Industry News: package and shear and stard (Page 1 of 2)

Nordson DAGE and Nordson YESTECH to Display X-ray and AOI Systems at NEPCON China

Industry News | 2014-04-16 13:17:25.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # B-1F25 at NEPCON China, scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.

Nordson DAGE

Nordson DAGE and Nordson YESTECH to Display Market Leading AOI, Bond Test and X-ray Inspection Systems at NEPCON South China

Industry News | 2014-07-30 12:10:12.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # A-1H30 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Nordson DAGE

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Industry News | 2014-09-05 13:53:06.0

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.

AI Technology, Inc. (AIT)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-30 21:06:08.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

Henkel Electronic Materials

Nordson to Showcase Market-Leading Test and Inspection Systems at NEPCON South China

Industry News | 2016-07-30 19:34:22.0

Nordson DAGE and Nordson MATRIX, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre. Nordson DAGE will showcase its new 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 and 4000Plus Bondtester. Nordson MATRIX will showcase its high-speed X3 Inline AXI system.

Nordson DAGE

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Industry News | 2023-01-23 18:38:38.0

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus

Nordson DAGE to Exhibit Best-in-Class Test and Inspection Equipment at NEPCON China

Industry News | 2015-04-02 18:36:37.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand B-1F28 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. Nordson DAGE’s team of Test and Inspection experts will demonstrate the 4000Plus Bondtester and XD7600NT Diamond FP X-ray inspection system.

Nordson DAGE

Heraeus Electronics showcases new portfolio for next-generation power electronics and semiconductor advanced packaging at SEMICON Korea 2023

Industry News | 2023-01-30 16:56:37.0

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus

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